AAEON presents its line of AI@Edge solutions powered by Intel Movidius Myriad X VPUs.           AAEON, an award winning leader in AI@Edge solutions, presents its AI platforms powered by Intel Movidius Myriad X. As the first company to produce an mPCIe module to feature the Intel Myriad X VPU, AAEON is continuing to lead the industry in offering powerful, flexible AI platforms with Intel solutions.   At the heart of AAEON AI solutions is the Intel Movidius Myriad X. The Intel Myriad X is a low-power high-performance VPU capable of a wide range of AI applications, fr|om controlling drones to performing industrial inspections. The Myriad X is capable of processing speeds up to 105 fps (80 typical) and 1 TOPS as a dedicated neural network accelerator. The Intel Myriad X is compatible with Intel OpenVINO, making it easy to setup and run AI inference software. By working closely with Intel, AAEON has developed a wide range of AI solutions powered by Intel Myriad X. fr|om modules to boards and systems, AAEON provides flexibility and scalability that is unparalleled. AAEON continues to lead development of new platforms and solutions built for AI in industry and at the edge.     AAEON’s innovative line of AI modules powered by Intel Movidius Myriad X, the AI Core X family, offers a range of scalable solutions to give existing platforms an AI boost to perform at the edge. AAEON offers powerful solutions such as the AI Core X, the first mPCIe module to feature Intel Myriad X; AI Core XM2280, an M.2 22x80 module with two Myriad X VPUs; and our latest solution, the AI Core XP4 and XP8 PCIe x4 card. The AI Core XP4 and XP8 offer between four and eight Intel Myriad X VPUs, providing flexibility and scalability for any PC platform.   AAEON offers embedded board solutions with AI power including the GENE-APL7 subcompact board and EPIC-KBS9 single board computer. The GENE-APL7 offers customers flexibility with two mPCIe mini Card slots, support for up to ten USB ports or ten COM ports, perfect for applications with need for a large number of I/O devices such as smart retail or banking. The EPIC-KBS9 SBC offers customers AI scalability with its PCIe x4 slot and support for 7th Generation Intel Core processors. The EPIC-KBS9 can power high-performance applications such as visual defect inspection.   AAEON brings the power of AI@Edge to network video recording applications with the VPC-5600S with AI Core X. Built for in-vehicle computer and smart security applications, the VPC-5600S features the powerful 7th Generation Intel Core processors. It also features a wide array of I/O ports, with eight POE ports, four USB 3.0 and two LAN ports, supporting up to fourteen network cameras. With the AI Core X, the VPC-5600S brings AI@Edge solutions to security and monitoring, powering Virtual Fence technology for motion detection, foot traffic and flow monitoring, and other smart monitoring applications.   AAEON provides high performance AI processing with the FWS-8600. Powered by the Second Generation Intel Xeon SP processors, which feature Intel Deep Learning Boost, the FWS-8600 supports up to two AI Core XP8 PCIe x4 cards. That’s a total of 16 Intel Myriad X VPUs built to deliver high computing performance for the most demanding of industrial applications. Capable of supporting over 200 IP cameras, the FWS-8600 with AI Core XP8 can power multiple AI@Edge applications simultaneously, including automated warehouse and logistical processing, production line monitoring, and even door security and access control, all at the same time with one machine.   Launching summer 2019 is the newest line of AI@Edge systems fr|om AAEON, the BOXER-8300AI series of Intel Myriad X AI@Edge embedded systems. Built for the harsh environments of industrial applications, the BOXER-8300AI series powers AI Edge computing applications for worker safety, license plate identification, and visual inspection (AOI). It’s easy to find a system to match your application’s needs, whether it’s the BOXER-8310AI powered by AI Core X, the BOXER-8320AI with two Intel Myriad X VPUs, or the BOXER-8330AI featuring the AI Core XP4 or XP8. The BOXER-8300AI series features compatibility with Intel OpenVINO, a rich compliment of I/O ports for cameras and sensors, and improved thermal performance and operation over standard AI products.   For customers in need of a more creative AI Edge solution, AAEON’s UP Squared AI Developer Kit brings the power of Intel Myriad X in a compact size that’s ready to go the moment you take it out of the box. Available as a complete system or board, the UP Squared AI Developer Kit comes preloaded with Windows 10 and Intel OpenVINO toolkit, and includes an EverFocus USB Camera.   Coming soon to AAEON’s UP Board line is the UP Xtreme, powered by the 8th generation of Intel Core processors, formerly Whiskey Lake. Built with expandability in mind, the UP Xtreme can support up to six Intel Myriad X VPUs with AI Core X, AI Core XM2280 and the Vision Plus X card. It offers power for a range of solutions fr|om machine vision applications to a compact but powerful Edge Server solution.   As with all of our products, AAEON offers manufacturer services and OEM/ODM support. fr|om custom configurations to building a solution to fit the unique requirements of your application, AAEON provides end-to-end hardware support and solutions.   AAEON is leading the industry in AI@Edge with innovative designs featuring Intel Myriad X and award winning solutions powering the next generation of industrial AI and AI Edge applications. You can find out more by visiting our Intel Solutions web page on AAEON.com.    

    The BOXER-8170AI powered by NVidia Jetson TX2 features four PoE LAN ports and four USB 3.0 ports for fast, flexible and stable AI@Edge computing.                      AAEON, an industry leader in AI solutions, announces the BOXER-8170AI, our newest embedded AI@Edge computing solution featuring the NVIDIA Jetson TX2. Equipped with four PoE LAN ports and four USB 3.0 ports, the BOXER-8170AI provides stability and flexibility for AI edge networks.   The BOXER-8170AI features the powerful NVIDIA Jetson TX2 6-core processor, designed by pairing the Dual Denver 2 and Quad ARM 57 processors into a single SOC. This unique design with up to 256 CUDA cores provides speed and performance to power AI@Edge solutions. The BOXER-8170AI comes with 8GB LPDDR4 memory and 32GB eMMC storage onboard, and supports AI frameworks such as TensorFlow and Caffe, as well as supporting AI inference software fr|om developers and customers.   The BOXER-8170AI is built to provide flexibility and stability for AI Edge networks. It is designed with four PoE LAN ports, each with their own dedicated chip. This allows for higher bandwidth and stability for each port, allowing PoE cameras to operate individually on dedicated connections. The BOXER-8170AI supports a maximum output of 60 watts for up to four PoE cameras, perfect for a range of AI solutions incorporating PoE cameras such as smart retail, virtual fences, and access control.   The BOXER-8170AI is designed with a wealth of I/O features including four USB 3.0 ports, allowing for additional cameras or devices to be connected to the system. The BOXER-8170AI also features two COM ports for easy integration into industrial systems, two HDMI ports, and remote ON/OFF. The BOXER-8170AI is built to easily connect to networks with a Gigabit LAN port and two antenna ports to connect to wireless networks or act as an AIOT gateway. The BOXER-8170AI also features an SD Card slot and USB OTG for easy maintenance.   Built for the harsh environments of industry, the BOXER-8170AI features a fanless design and all aluminum chassis protecting the system fr|om dust, vibration and other hazards. The BOXER-8170AI is capable of operating in temperatures fr|om -20°C to 50°C and features a wide input voltage range of 12 to 24 VDC. With a compact height only 48 mm thick, it can fit into almost any convenient space needed to power AI Edge applications. “The BOXER-8170AI provides users with a stable platform for PoE connected cameras and AI solutions,” said Ethan Chiu, Product Manager with AAEON System Platform Division. “Our customers will enjoy a reliable and flexible platform for deploying edge computing networks and developing AI applications.”      

The COM-CFHB6 fr|om AAEON features 8th/9th Generation Intel Core Processors, capable of powering high performance and Edge Computing applications.   AAEON, an industry leader in embedded computing, announces the COM-CFHB6 Computer-on-Module. Featuring the 8th and 9th Generation Intel Core Processors, it is built to bring flexible computing to any embedded project.   The COM-CFHB6 is built to the COM Express Type 6 form factor. It features a wide range of processors fr|om the Intel Celeron to Intel Xeon, and the 8th and 9th Generation Intel Core processors (Coffee Lake H/Coffee Lake Refresh). The COM-CFHB6 supports low power 25W processors, perfect for mobile applications, up to 45W 6-core Xeon server CPUs. Combined with support for up to 48 GB DDR4 memory with ECC support (Xeon, Core), the COM-CFHB6 is built to provide high performance in the most demanding of applications.   The COM-CFHB6 is built for flexibility with powerful I/O and expansion features. It supports four USB 3.1 Gen 2 ports and eight USB 2.0 ports, up to three display ports, and up to 24 PCI Express 3.0 lanes, perfect for edge computing and AI applications. The COM-CFHB6 also features a slim cooler design, only 28 mm tall, allowing the COM-CFHB6 to fit into almost any tight space.   With the combination of power and flexibility, the COM-CFHB6 is right at home with a wide range of applications, including digital signage, factory automation, and robotic controller. It can even be used as an edge device or AIOT gateway in Smart City applications.   AAEON also offers Q-Service Plus for the COM-CFHB6, our manufacturer and OEM/ODM service. AAEON works closely through the entire process, fr|om board design, BIOS setup, and product testing, to provide an embedded solution that is built for your specific needs.   “Whether your application is in transportation or medical devices, the COM-CFHB6 is a powerful solution that can bring edge computing to your project,” said David Huang, Product Manager of Embedded Computing at AAEON. “With the COM-CFHB6, your project will have the power it needs to get the job done.”    

페이지 제목 AAEON announces the release of our newest line of AI@Edge Box PCs, the BOXER-8300AI Series. The BOXER-8300AI Series offer AI@Edge solutions using the Intel® Movidius™ Myriad™ X VPU.AAEON, the award winning industry leader in AI@Edge solutions, announces the launch of the BOXER-8300AI Series. Including the BOXER-8310AI, BOXER-8320AI, and the BOXER-8330AI (Coming Q4 2019), this family of AI@Edge embedded box PCs power AI and edge computing thanks to the innovative Intel® Movidius™ Myriad™ X.At the core of the BOXER-8300AI series is the innovative AI Core X module fr|om AAEON. Each AI Core X module features the Intel® Movidius™ Myriad™ X VPU. The Intel® Movidius™ Myriad™ X provides high performance processing, with speeds up to 105 fps (80 fps typical) and 1 TOPS as a dedicated neural network. The BOXER-8300AI Series features improved thermal design, allowing the Intel® Movidius™ Myriad™ X to operate at higher temperatures without loss of performance.The BOXER-8310AI offers users entry-level value and performance in a compact fanless system. Small enough to fit almost anywhere, this embedded AI@Edge system is powered by a choice of Intel® Pentium™ N4200 or Intel® Celeron™ N3350 processors with up to 8 GB of RAM. The BOXER-8310AI features one AI Core X module, providing users with processing capability to power AI solutions such as traffic monitoring, people counting, or even smart retail solutions. With its improved thermal design, the BOXER-8310AI can operate easily in temperatures fr|om -20°C to as high as 55°CThe BOXER-8320AI brings the power of the 6th Generation Intel® Core™ i3 Mobile Processor as well as two AI Core X modules, offering processing speeds up to 210 fps (160 typical). The fanless BOXER-8320AI is built with a din-rail mount design and form factor, allowing it to easily integrate into any industrial space, or control cabinet. The advanced thermal design of the BOXER-8320AI allows it to operate in conditions fr|om -20°C to 60°C. With the power of the Intel® Core™ i3 processor and two AI Core X modules, the BOXER-8320AI can be used in high-performance AI applications such as smart security, facial recognition, and more.The BOXER-8300AI series offers users several advantages over other embedded AI@Edge systems. All BOXER-8300AI systems are compatible with the Intel® Distribution of OpenVINO toolkit, allowing users to run AI inferences on existing frameworks (such as TensorFlow or Caffe) or to create their own. The BOXER-8300AI supports expandable storage, supporting the full suite of Linux and Ubuntu. This also allows the BOXER-8300AI series to be expanded with support for wireless cards such as WiFi, 4G, or Bluetooth. Memory is also easy to replace and upgrade.AAEON offers all of our customers support to get their projects off the ground. Our manufacturing services and OEM/ODM support provides end-to-end guidance to see your project fr|om concept to production and beyond. For others, AAEON offers complete Linux with Intel® Distribution of OpenVINO toolkit images which can be downloaded fr|om AAEON to get your BOXER-8300AI system up and running the moment you turn it on.   “The BOXER-8300AI series with AI Core X offers our customers a competitive solution to powering AI and Edge Computing,” said Ken Pan, Product Manager with AAEON’s System Platform Division. “With AAEON’s industry leading support, it’s easier than ever for customers to make the choice for an Intel® based AI@Edge platform.”  

홈페이지 | 연락처   내구성 강도    산업 등급 고용량 DRAM 시리즈    업계 최대 메모리 용량    초당 최대 전송률 2666MT/s   Innodisk의 32GB DRAM 모듈은 확장된 용량으로 론칭된 최신 산업 등급 고용량 DRAM 시리즈입니다. 훨씬 더 빠르고 더욱 신뢰도 높은 모바일 기간망 서비스 5G 기술 용도로 32GB DRAM을 필요로 하는 코어 네트워크 스위치용 시리즈입니다. 이렇게 더 빨라진 데이터 DRAM을 이용해 최적화된 가상화 시스템을 제공합니다. 특히, AIoT 기기, 의료 데이터 기록 센터의 가압기 검증 및 백신 모니터링 등에는 더 신속한 처리가 필요합니다. 2,666MT/s의 빠른 전송율을 이용해 저지연 네트워크 속도를 지원하는 Innodisk의 32GB DRAM 모듈은 일관성 있는 처리 용량을 제공하는 데 있어 필수적인 역할을 합니다. NAS 장치에 사용되는 경우 32GB DRAM 모듈은 신속하고 매끄럽게 저장 및 회수 작업을 수행합니다. 우주항공 및 방위 산업 부문의 경우 DRAM 모듈에 부식 손상이 발생해 모듈 오작동을 초래할 위험이 높습니다. 이러한 환경은 유황 함량이 높은 만큼 공기 중의 황 함유 입자가 과도하게 쌓이는 것을 막아 주는 Innodisk의 항유황 보호 기능이 필수적입니다. 또한, 광범위한 온도 솔루션은 최대 85°C까지 견디면서 황화 가속화를 최소화하고 제품 수명을 늘려 주며, 열 분산기는 열 발산 가속화를 도와줍니다. Innodisk의 32GB DRAM은 AMD x570, Intel Z390/Z370 칩셋, AMD Ryzen 3000 Gen 3 및 Intel Coffee Lake CPU와 호환됩니다. UDIMM/SODIMM/ECC-SODIUM 폼 팩터로 출시되며, Innodisk는 제조사들에게 컴팩트한 장기적 성능을 제공합니다.   IoT 지원 고속 메모리 2666MT/s 가상화 지원 32GB 고용량 메모리 부식 내성     대상 고객 5G 기술 구현업체 코어 네트워크 스위치 제조사 우주항공 및 방위 산업 높은 내구성을 요구하는 IoT 환경   내구성 및 신뢰성 항유항 성능 폭넓은 동작 온도-40⁰C ~ 85 ⁰C 열 분산기     플랫폼 호환성 AMD x570 & Intel Z390/Z370 AMD Ryzen 3000 Gen. 3 Intel Coffee Lake (CPU) UDIMM/SODIMM/ECC-SODIMM 폼 팩터   DDR4 2666 32GB SODIMM자세히 보기 »       DDR4 2666 32GB UDIMM자세히 보기 »     DDR4 2666 32GB ECC SODIMM자세히 보기 »       DDR4 2666 WT 32GB SODIMM자세히 보기 »     DDR4 2666 WT 32GB UDIMM자세히 보기 »       DDR4 2666 WT 32GB ECC SODIMM자세히 보기 »          2019 에디션: Innodisk 임베디드 솔루션선택 가이드 최신 산업용 플래시 스토리지, DRAM, I/O 확장 및 클라우드 모니터링 솔루션에 대해 알아보세요!다운로드 》 » 도움이 필요하십니까?연락해 주시면 문의사항을 해결하는 방법을 알려 드립니다연락처(제품문의)》 »  

UP Core Plus is the 2nd Generation of UP Core modular maker boards, powered by Intel Apollo Lake processors, with Net Plus and Vision Plus X boards which offer customization for your project. AAEON, an award winning developer of Edge AI Computing solutions, announces the 2nd Generation of UP modular boards, the UP Core Plus maker board along with the Net Plus and Vision Plus X docking boards. Together these board kits provide developers and easy way to build a system designed for the needs of their project, whether it’s a compact networking device, or a powerful AI Edge system. The UP Core Plus is the 2nd Generation of the UP modular maker board fr|om AAEON. Featuring Intel Apollo Lake processors, the UP Core Plus offers a great leap in performance over the previous generation. The board can be configured with up to 8 GB of onboard memory, and up to 128 GB onboard eMMC storage. The UP Core Plus also features USB 3.0, DP, and USB OTG connections, as well as support for wireless and Bluetooth connectivity. The UP Core Plus also supports up to four PCI express lanes thanks to the Apollo Lake processors. While the UP Core Plus has fewer I/O ports than the UP Squared, it offers unmatched flexibility thanks to its two 100-pin connectors. With these connectors, users can add-on docking boards that help tailor the board to their applications. AAEON currently offers two boards as part of the UP Core Plus family, the Net Plus and UP Vision Plus X. The Net Plus docking board expands the I/O support of the UP Core Plus system, with four Intel i211 Gigabit LAN ports, or optional Intel i210 with Time-Sensitive Network (TSN) support. It also features a SATA port for hard drive support, as well as an mPCIe slot which supports a wide range of Mini-Card solutions, including 4G, WiFi, and more. The Net Plus is perfect for developers looking to build a compact network device, or to connect multiple network devices to the system. The Vision Plus X board brings the power of AI@Edge to the UP Core Plus. Featuring three Intel Movidius Myriad X VPUs, the Vision Plus X offers a high-performance solution to powering AI applications. With a built in mPCIe slot, developers can push the count up to four Intel Myriad X VPUs with the addition of the AI Core X module. The Vision Plus X is perfect for bringing to life AI Edge applications such as facial recognition and smart retail. The UP Core Plus fr|om AAEON offers developers unmatched flexibility to power their projects. Users can use the UP Core Plus board as a standalone system by itself, or expand with the Net Plus or Vision Plus X boards. AAEON also offers a carrier board design guide available through the UP Community, allowing users to build their own custom board configurations and layouts. The 2nd Generation modular board, UP Core Plus fr|om AAEON, is built to power up your project.

AAEON announces the launch of the ASDM-S-KBU smart display module featuring 7th Generation Intel Core processors and OpenVINO capabilities for applications such as kiosks and displays with AI context-recognition applications. AAEON, an industry leader in embedded solutions, announces the ASDM-S-KBU, the only Intel SDM Small (SDM-S) module featuring 7th Generation Intel Core processors (formerly Kaby Lake). The ASDM-S-KBU offers unparalleled computing power for its compact size, capable of powering AI Edge applications. The ASDM-S-KBU brings the high performance of Intel Core processors to the compact Intel SDM-S form factor. As small as a credit card, the ASDM-S-KBU combines the 7th Generation Intel Core series and Celeron 3965U processors with up to 8GB of DDR memory, providing scalability for smart displays that are slimmer and more compact. The ASDM-S-KBU can power embedded computing applications such as interactive kiosks and smart vending machines. The ASDM-S-KBU features the performance to push smart displays to the Edge. Tested compatible with OpenVINO, the ASDM-S-KBU can power AI Edge applications for smart displays. Applications include context sensing in virtual dressing rooms, which can determine a person’s age, gender and body shape. It can also be used to power Smart Retail and Smart Vending solutions, or even deployed as part of the Smart City ecosystem. The ASDM-S-KBU is backed by the same industry leading support offered with all AAEON products. fr|om technical service that promises a response within 72 hours, to our manufacture services and OEM/ODM support, AAEON is the reliable partner for developers and system integrators. AAEON offers end-to-end support for the ASDM-S-KBU, including carrier boards and system chassis to help you build your project. “The ASDM-S-KBU brings the power of Intel Core processors and Edge Computing to compact smart display systems,” said Ian Lin, Project Manager with AAEON’s Embedded Computing Division. “Backed with AAEON support, the ASDM-S-KBU is the best solution for smart displays in education, digital signage, and more.”

The FWS-7831 network appliance fr|om AAEON is a network solution that brings capable and powerful network applications in a platform that is friendly to both users and budgets. AAEON, an industry leader in network solutions, announces the FWS-7831 network appliance. The FWS-7831 is powered by the 8th Generation Intel Core and Xeon processors, formerly Coffee Lake, and offers powerful network applications such as UTM and SD-WAN in a package that is both user and budget friendly. The FWS-7831 is designed with support for the 8th Generation Intel Core and Xeon processors (Coffee Lake) up to 6 cores. Combined with up to 32 GB of DDR4 SODIMM ECC memory, the FWS-7831 is powerful enough to provide over 48 Gbps throughput depending on configuration. With the FWS-7831, AAEON continues to offer network appliances built with flexibility. The FWS-7831 can be configured with eight Intel i211 Gigabit Ethernet ports, or two SFP Ethernet ports with six Intel i211 Ethernet ports. The FWS-7831 also features a NIM slot, perfect for additional expansion and customization, allowing customers up to eight additional ports, for a total of up to 16 Ethernet ports supported. Customers can also use the NIM module for network virtualization. Other I/O features include USB 3.0, RJ-45 console, and HDMI ports. The FWS-7831 is also built to be a friendly to use system. With a shorter chassis than most typical rackmount systems, the FWS-7831 is easy to set up and install even without a rack, and can be used outside of dedicated server rooms. It provides users with support for applications such as unified threat management (UTM) and software defined wide access networks (SD-WAN). It can also be paired with other network appliances for web monitoring and load balancing applications. “The FWS-7831 is a cost effective and user friendly network solution for customers looking for a mid-range network solution,” said Caridee Hung, Product Manager with AAEON’s Network Systems Division. “Customers will find exactly the solution they need thanks to the 8th Generation Intel Core and Xeon Processors and the flexibility provided by the FWS-7831.” The FWS-7831 is the newest addition to the family of network appliances fr|om AAEON, and joins the FWS-7830 in expanding our range of appliances powered by the 8th Generation Intel Core and Xeon Processors.

5G는 이미 본격적으로 기존의 4G 표준을 대체하고 있으며, 그 비전은 가히 혁명적이라고 할 수 있습니다. 4G만 해도 다운로드 속도가 빠르다고 여겨지고 있는데 5G는 그 속도를 10배로 늘릴 수 있습니다! 더 나아가, 지연 시간이 현격하게 짧기 때문에 디바이스들 간 연락 속도도 훨씬 더 빨라집니다. 5G를 mMTC (Massive Machine-Type Communications, 대규모 사물통신)와 결합하면 넓은 지역에 걸쳐 수천 대의 디바이스 간에 수월한 통신이 가능해지며, 그에 따라 대규모로 AIoT 솔루션을 구현하는 데 따른 통신 문제도 해결할 수 있습니다. 대표적인 예를 들면, 이를 이용해 차량 간 통신과 무인 차량 신뢰도가 높아져 교통 상황을 더 안전하고 효율적으로 만들 수 있을 것입니다. 5G 네트워크는 SDN (Software Defined Networks, 소프트웨어 정의 네트워크)과 NFV (Network Function Virtualization, 네트워크 기능 가상화)를 통해 실현 가능합니다. 이러한 유형의 인프라는 엄청난 규모의 사용량 증가가 예상되는 상황과 급격한 수요 등락에 맞춘 확장을 처리하는 데 필요합니다. 다시 말해, 여기서 중요한 것은 연결성이 아니라 실행하는 애플리케이션들을 모두 처리하는 중앙 인프라의 성능이라는 것입니다. 그것이 바로 충분한 메모리가 반드시 필요한 이유이며, 특히 5G 네트워크의 핵심 부분의 경우 더욱 그렇습니다. Innodisk는 서버와 네트워크용으로 최적화되고 빠른 전송 속도를 자랑하는 고용량 모듈을 공급하고 있습니다. 모든 IC는 오리지널 제품이며 엄격한 사내 테스트를 통과했습니다. 또한, 모든 DRAM 솔루션은 고정 BOM과 함께 제공되는 만큼 공급을 염려하실 필요가 없습니다. mMTC (대규모 사물통신)  •단일 네트워크를 통해 수천 대의 디바이스 간 연결 원활화 •테스트를 거친 오리지널 IC 와 고정 BOM으로 신뢰할 수 있는 DRAM으로 구동 최고의 신뢰도를 자랑하는 저지연 통신  •무인 차량, 공장 로봇 등 디바이스 간 신속한 통신 지원 •저지연 네트워크 속도 지원을 위해 고속 2666MHz DRAM 사용 기하급수적 대역폭 증가  •속도 증가는 네트워크 상에 연결된 디바이스와 애플리케이션 수의 증가를 의미 •고용량 32GB DRAM 모듈로 수요 충족

With a storage and memory portfolio highly suitable for IoT applications, Innodisk is ready to help solve the challenges of AI implementation in the medical market Taipei – Medical technology is one of the fields where AI can bring revolutionizing breakthroughs for diagnostics, patient care, and emergency rooms. AI excels at working through enormous data sets and can draw fr|om experiences much wider than any single doctor. But this sophisticated technology requires sufficient computational powers, and this is where the Innodisk solution excels. Innodisk’s memory solution includes a diverse portfolio of industrial-grade DRAM modules that comes with guaranteed long-term supply. Other than high-performance DDR4 modules, DDR2 and DDR3 solutions are also available in the same robust form factors. For extreme cases, conformal coating and anti-sulfuration measures are available to further protect the memory module. Innodisk has ample experience in providing storage solutions to the medical sector. For instance, when designing an MR or CR systems, it is necessary to factor in electromagnetic interference. A special circuit design with purpose-built firmware algorithms is necessary and Innodisk has successfully customized modules with anti-magnetic properties as well as with rigid data security measures for medical devices. Innodisk can provide SSDs that offer extensive endurance and the robustness required of IoT devices in a medical setting. One of the challenges of AIoT is keeping tabs on the many devices involved in the system. In one such case, Innodisk modified the cloud-based management tool iCAP to not only monitor the onboard component lifespan and status, but also that of the batteries in the various portable devices used at the hospital. This way, all devices are kept under one umbrella that is easily accessed through any computer, phone or tablet with a compatible browser. Another aspect of adding devices is the need for adding additional ways of communication between the devices themselves. This is easily achievable through Innodisk’s expansion cards. This way, medical devices can easily add new ports that offer additional LAN, display, PoE, USB capabilities.

Using Sophisticated Demos, Innodisk is Demonstrating How Memory and Storage can power Smart Surveillance, Smart Transportation, Smart Factory and Smart Medical Applications Taipei – AI is the future of IoT. To highlight the possibilities these bring, Innodisk is showcasing four of the main AIoT markets at Computex 2019. Facial Recognition and AI-powered Transportation  The first thing to greet visitors to the booth is a facial recognition entrance. This setup shows how entering and exiting the office can be done in a secure and unobtrusive manner. Moving on, we enter the transportation area where a real-time fleet management system is run through Innodisk’s cloud management platform iCAP™. Additionally, a miniature scale intersection will showcase how vehicles can be tracked through an intersection to help analyze and streamline traffic flow. Smarter Quality Control and Medical Innovation  The next section is the Smart Factory which shows how AI and machine vision can detect discrepancies in fabrics faster and more keenly than any human operator. And lastly, we arrive at the Innodisk Smart Medical segment where a customized iCAP platform demonstrates how a nursing station can integrate all connected devices under one umbrella for easy management. Latest Innovations  Fire is no issue for data retention with the new Fire Shield SSD. Successfully tested to withstand 800°C for 30 minutes, the Fire Shield SSD can save your data if disaster strikes. For the DRAM side, the 32GB modules are ready to bring high capacity to the IoT market. Combining this with wide temperature, Anti-Sulfuration and ECC functionalities gives you the optimal industrial-grade DRAM solution. For expansion cards, the new M.2 Graphics Card can deliver both 4K UHD and FHD. With a DDR3 IC on board, this miniature graphics card is tailor-made for space-constrained IoT applications.

Years of experimentation and innovative design has culminated in Innodisk’s newest “Black Box” data storage device for transportation and in-vehicle recording, the Fire Shield SSD™ Taipei –After many trials and a lengthy design process, the Fire Shield SSD™ has passed its baptism of fire. After having been bathed in direct flames at 800°C for more than 30 minutes, comparisons show 100% data accuracy before and after tests. The U.S. patent has already been granted USPTO. The Fire Shield SSD™ design borrows fr|om the concept of black boxes. It is placed inside vehicles and public transportation for the purpose of facilitating accident investigation. Modern vehicles are designed with safety in mind. But no matter the safety measures, fire is always a risk. In the US alone, there are more than 400 fire-related vehicle accidents every year, and what is often forgotten is the importance of data after such an accident, as it might be the only clue to the underlying causes. This is why Innodisk has created the Fire Shield SSD™. The Fire Shield SSD™ consists of a triple layer of protection between the environment and the core components. The layers include flame-resistant copper alloy, drive-protecting connector design, and heat-isolating lining material. By combining more than 20 different heat-resistant materials with low heat-conducting properties, the SSD effectively shields the NAND flash fr|om extreme heat. Innodisk’s Fire Shield SSD™ is available as a SATA 3.5” SSD form factor and will be displayed at Innodisk’s booth at this year’s Computex in Taipei.  

The BOXER-8150AI powered by NVidia Jetson TX2 features eight USB 3.0 ports providing higher bandwidth for USB cameras and devices. AAEON, an industry leader in AI solutions, announces the BOXER-8150AI, the latest in the BOXER-8100AI family of compact embedded AI Edge solutions powered by NVIDIA Jetson TX2. Featuring eight USB 3.0 ports, the BOXER-8150AI is designed to maximize framerates by providing higher bandwidth for USB connected cameras. The BOXER-8150AI features the powerful NVIDIA Jetson TX2 CPU paired with 8GB LPDDR4 memory and 32GB eMMC storage onboard. The NVIDIA Jetson TX2 utilizes a unique design to provide 6-cores of processing power by pairing the Dual Denver 2 and Quad ARM 57 processors into a single SOC. The NVIDIA Jetson TX2 is capable of supporting up to 256 CUDA cores and supports AI frameworks such as TensorFlow and Caffe, and can be configured to utilize the customer’s own AI inference software. The BOXER-8150AI stands out fr|om the crowd with its unique configuration of eight USB 3.0 ports. The BOXER-8150AI is designed with four USB chips, each controlling a pair of USB 3.0 ports. By dedicating one chip to one pair of ports, each chip handles less data traffic overall, improving bandwidth fr|om connected devices and allowing the BOXER-8150AI to maximize processing speeds and framerates. Higher framerates allow for AI software to process images faster, more reliably and with greater accuracy. With this configuration, the BOXER-8150AI is able to support up to eight USB connected cameras or devices, each operating independently of one another. This powerful configuration is perfect for a wide range of computer vision applications like visual inspection, quality control, and facial recognition. The I/O features of the BOXER-8150AI doesn’t just stop with its USB ports. The BOXER-8150AI features a COM port for easy integration into industrial systems. It also features a Gigabit Ethernet port and two antenna ports for easy connection to any kind of network, or even as a mobile device. Other I/O features include two HDMI 2.0 ports, an SD Card slot, USB OTG, and remote ON/OFF. Built for Industry 4.0, the BOXER-8150AI features a fanless design and all aluminum chassis, making it tough enough to handle he rigors of any work place. It is capable of operating in temperature ranges fr|om -20°C to 50°C and features a wide input voltage range of 10 to 24 VDC. With a compact size only 30 mm thick, it’s another design fr|om AAEON that is built to work anywhere you need it. “The BOXER-8150AI offers a unique design which maximizes bandwidth and provides higher framerates for developers and customers who require their application to interface with a large number of USB connected devices,” said Ethan Chiu, Product Manager with AAEON System Platform Division. “The BOXER-8150AI is the embedded system that offers AI at the speed of sight.”

  The AI Core XP4 and XP8 offer up to eight Intel Movidius Myriad X VPUs on a PCI Express [x4] card, and provide users with scalability for PC-based AI applications.AAEON, an award-winning leader of AI edge solutions, announces the latest products in our line of AI modules featuring the Intel Movidius Myriad X, the AI Core XP4 and XP8. The AI Core XP4 and XP8 offer users a scalable solution on a PCIe(x4) form factor for PC-based AI applications and neural network acceleration.While most PCs are capable of handling AI applications, the computations required are often quite complex and data intensive, limiting the speed at which the AI inference can operate, or slowing down performance of other applications which must run simultaneously. The AI Core XP4 and XP8 allow users to offload the AI inference fr|om the main CPU processor, speeding up AI processing, and freeing the CPU to handle other important tasks.The AI Core XP4 and XP8 feature four (XP4) or eight (XP8) Intel Movidius Myriad X VPUs. Each Intel Myriad X VPU is capable of speeds up to 105 fps (80 typical) and up to 1 trillion floating point operations as a dedicated neural network. This means a performance of up to 840 fps (560 typical) with the AI Core XP8, providing incredible processing power for your AI applications.The AI Core XP4 and XP8 bring users scalability not offered on any other PCIe based AI module card. While other cards are designed with VPUs soldered directly onto the boards, the AI Core XP4 and XP8 are designed by combining two to four AI Core XM 2280 modules onto a single card. This means the AI Core XP4 and XP8 feature four M.2 slots, allowing users the ability to scale the capabilities of the card to match their needs. Users can easily add an additional AI Core XM 2280 module to the AI Core XP4 giving the power of six Intel Myriad X VPUs. This scalability is perfect for users whose processing needs may change over time, or are unsure exactly how much performance they need; providing the option to change the power available without having to buy an entire new card.As with all of our award winning products, AAEON offers manufacturer service for customers who have exact needs, providing support in finding and developing solutions to fit your needs. The AI Core XP4 and XP8 bring more flexibility and scalability to our innovative line of AI Core X modules featuring Intel Myriad X, and provides a powerful solution for PC-based AI edge applications.

While e-commerce gets all the attention, research conducted by the IHL Group shows that big chains plan to open more than 5,500 more stores than they close in 2018. But even as traditional stores continue to thrive, retail is becoming ever more competitive. To deal with the ongoing transformation of the marketplace, many merchants are seeking to emulate e-commerce in how they use data to increase sales and improve customer service. Bringing these smarts out of the cloud and into the store requires a new approach to collecting, managing, and analyzing data. Specifically, retailers need deep learning solutions that provide value at the edge, handling large volumes of images and data within retail locations-¬. The solution often requires using heterogeneous mixes of CPUs, GPUs, FPGAs, and other processors, while adhering to strict power, space, bandwidth, and privacy requirements. With that in mind, developers are discovering ways to use existing APIs and frameworks to maximize the portability, flexibility, and scalability of their retail solutions. Developers are also relying on a new generation of off-the-shelf AI hardware and software specifically designed for edge applications. Suchtechnologies simplify and speed up the creation of new solutions, allowing developers to apply the power of AI and machine learning to new environments. XXXL Performance in Petite Sizes A retail AI solution must produce, store, and manage a vast amount of data—particularly for solutions based around video analytics. Cloud-based solutions are often infeasible due to latency, network bandwidth, reliability, and security issues. What’s needed for retail is an edge solution that offers tremendous compute power while requiring relatively little energy. On top of that, it must fit into a small form factor. Recent developments at Intel® support solutions that offer the necessary requirements. UP Bridge the Gap, a brand of AAEON Europe, has developed a family of neural accelerators that run on cutting-edge hardware. Powered by Intel® Movidius™ Myriad™ X VPUs, these cards are designed to handle computer vision and AI applications in a tiny, low-power package (Figure 1). Figure 1. The UP AI Core X series is powered by Intel® Movidius™ Myriad™ X VPUs. (Source: UP Bridge the Gap) For example, these cards are used in the UP Squared AI Edge: Retail Suite, a quick-to-deploy neural network engine designed for modern commerce. The Retail Suite comes preloaded with software fr|om AIM2 and Cortexica, and supports frameworks such as Caffe, TensorFlow, and the OpenVINO Toolkit. It comes with: A 30x51mm UP Squared board based on an Intel Atom® x7-E3950 4GB RAM An Intel Movidius Myriad X 2485 VPU 64GB eMMC, WiFi (2T2R), and Bluetooth A USB3.0 camera with 3.6mm lens A pre-installed 1-year subscription to Retail Suite by AIM2 Available as a developer kit, the Retail Suite with its Intel Movidius Myriad X VPU delivers an estimated 10X performance increase over previous generations, making it a powerful option for AI at the edge. (See Figure 2.) Figure 2. The Intel® Movidius™ Myriad™ X VPU delivers an estimated 10X performance increase over previous generations. (Source: UP Bridge the Gap ) AI and Machine Learning Empower Retail The goal is an intelligent solution to extract insights fr|om video analysis to perform demographic, behavioral, and sentiment analysis. Retailers want to easily call up data on the age or gender distribution of customers, be it by the month or day of the week, as well as their emotional state. Do they appear happy or confused? Are they focused on specific brands or are they ignoring them? All of this can help retailers enhance their stores. We spoke about this solution with Luca Ruzzola, a machine learning engineer who leads data science and training at AIM2. He explained that the Retail Suite can be launched in Contextual Mode or in Brand Mode. In Contextual Mode, retailers gain contextual information for customer analysis. “The solution associates key performance indicators (KPIs) to a specific context,” said Ruzzola. “For example, a context can be the brand on a shelf, the name of a venue in a shopping center, or a specific zone of a venue such as the entrance or exit.” In Brand Mode, retailers can automate inventory tracking at the shelf level. Ruzzola said, “The solution enables retailers to improve efficiency. This includes stock detection and shelf monitoring to make sure that brands are positioned correctly and in the correct amount.” Brand exposure is also measurable. “It tracks customers standing in front of branded products on a shelf and how they engage with the products,” said Ruzzola. “It also enables retailers to track and analyze the types of customers that interact with the products—their gender, age range—while ensuring compliance with the General Data Protection Regulation (GDPR).” The mention of GDPR led to a discussion on the solution’s privacy settings. Ruzzola made clear that no video stream is transmitted and no frames are saved on the device. “The video processing occurs in real time,” said Ruzzola, “by creating a face signature using Neural Homogeneous Identities (NHI).” NHI enables the solution to automatically detect and organize identities without human support. Each face signature is encrypted and stored in a database. “However, the process of creating a face signature can’t be used to re-create an image of a specific face,” said Ruzzola. This face signature allows retailers to recognize when a specific customer re-enters the store without capturing his or her personal identity. That way the retailer can track an individual’s shopping habits, age range and gender, while ensuring privacy and security. Ruzzola described other face signature use cases, such as ensuring that only authorized employees can access restricted storage areas or offices. A related use case is to confirm that specific employees, such as security staff, are present in specific areas at specific times and performing specific functions. Not All AI Acts the Same Our conversation moved on to other companies developing in this space. Ruzzola explained that the Retail Suite differs fr|om its competitors by providing three critical advantages. First, the solution’s dual-mode system enables retailers to capture and analyze both contextual data and brand interaction data. “No other solution handles both of these aspects in a single suite,” he said. A second advantage is low cost. “AAEON hardware and the Intel stack keep costs down,” said Ruzzola. The third advantage is that the solution can deliver standard KPIs or raw data. “Standard KPIs allow retailers to quickly gain insight without analysts,” said Ruzzola, “or they can engage an analyst to scrutinize the raw data to achieve additional insight.” Closing the Gap with E-Commerce As AI and machine learning technologies mature and their costs come down, brick-and-mortar retailers can perform the kind of customer, brand, and product analytics that e-tailers take for granted. Retailers, excited about such opportunities, are gaining insight into customer behavior and preferences as well as which brands outperform others. The result? Retailers are more competitive and customer-driven.

Choosing the most appropriate server boot drive can save time, safeguard your data, and — ultimately — lower your total cost of ownershipEvery server needs to boot fr|om a local drive. These drives come in a variety of form factors and with a diversity of interfaces and protocols. Each type of drive embodies different advantages (and disadvantages), so deciding which is best isn’t necessarily a clear-cut choice.The first thing that might come to mind is performance requirements. Time shaved off the boot sequence can be immensely valuable. As for challenges, power consumption and heat dispersal are constant threats to server performance. Minimizing the amount of power consumed is certainly in the best interest of any data center operator, not to mention the fact that high temperatures can exacerbate data retention issues in flash memory.So what are the choices to consider, and who are the upcoming players? Let’s dive into the current status of server boot drives and see what the future holds.

Available in six SKUs, there's a BOXER-6841M model for all your AI and machine vision requirementsAAEON, a leading developer of advanced industrial solutions and AI hardware, launches the BOXER-6841M, a box PC built for both edge AI and machine vision applications. The controller is available in six different SKUs, with four AI models featuring PCIe(x16) slots for the installation of Nvidia® GPUs, and two machine vision models fitted with a pair of PCIe(x8) slots for frame grabber cards.Different BOXER-6841M models are built to support either Intel® Core® i desktop or Xeon® server grade CPUs, and they all boast up to 32GB of DDR4 ECC or non-ECC SODIMM memory and two 2.5” drive bays.The four AI models can be fitted with up to 250W GPUs. To support the high power requirements of these GPUs, AAEON has designed the BOXER-6841M with two 12Vdc power inputs. This innovative feature lowers costs and makes the system more stable by reducing the level of wasted heat that would be produced by a single 24V input.ALL BOXER-6841M SKUs feature five GbE LAN ports, four USB3.0 ports, two HDMI ports, dual mSATA slots, and an additional PCIe(x1) slot. The machine vision models can also support up to five COM ports to support legacy devices.“The BOXER-6841M is a range of computers rather than a single machine, and that means we can answer our customers’ image processing requirements, whatever they might be,” said Ethan Chiu, AAEON system platform division product manager.

The BOXER-6750 features an Intel® Core™ i3-6100U CPUAAEON, a leading developer of industrial computing solutions, releases the BOXER-6750, a DIN rail-mount-designed box PC with a rich I/O interface.The compact BOXER-6750 measures only 69mm x 183mm x 155mm and is fitted with the Intel® Core™ i3-6100U or, for customers with lower performance demands, the Intel® Celeron® 3955U. The system also features a DDR4 SODIMM slot for up to 16GB of memory, a 2.5” SATA drive bay, and an optional mSATA slot.The high-performance PC is perfect for SCADA applications, and with four USB3.0 ports, two LAN ports, and four COM ports, it can easily be connected to a range of peripheral devices. VGA and HDMI ports also enable dual display output. AAEON can also work with customers to customize the system, giving it up to six USB3.0 ports and six COM ports.The BOXER-6750 is also suitable for factory automation solutions and was designed to handle harsh, factory environments. It has an operating temperature range of -20°C to 60°C and a 9 to 30V power input range.“Ease of use is always an important factor when we design new systems,” said Roy Huang, AAEON System Platform Division product manager. “With the BOXER-6750, the majority of the system’s connectors are located on the PC’s front panel, making it ideally suited to DIN rail installation.”

Italian Post Office Shortens Queue Waiting Times with VIA Mobile360 HMI Panel Display Starter Kit Posted on March 31, 2016April 4, 2016 by Helena Szendzielorz Enhances the customer experience by providing critical real-time information Taipei, Taiwan, 31 March, 2016 – VIA Technologies, Inc, today announced that the Italian Post Office has deployed intelligent signage systems based on the VIA Mobile360 HMI Panel Display Starter Kit in post offices throughout the country. The customized all-in-one systems have been installed at each counter as part of a queue management system that allows customers to pre-book an appointment using the Italian Post Office mobile app. When the customer arrives for their appointment, they can view the display at the counter that was pre-assigned to them by the app to track their place in the line. In addition, large summary displays powered by VIA AMOS-820 systems have also been installed to greet customers as they enter the post offices, as well as provide back-up in the case of server downtime. “As more and more companies look for ways to integrate the convenience of mobile services with physical spaces, digital signage and kiosk installations are fast becoming an integral feature for all retail environments,” said Richard Brown, VP International Marketing, VIA Technologies, Inc. “With our new VIA Mobile360 HMI Starter Kits, we provide a flexible and affordable path for custom-building solutions that meet the exact requirements of the target deployment.” VIA Mobile360 HMI Starter Kits feature a highly-integrated low power motherboard and validated LCD screens to provide the fastest and smoothest path for building smart display devices for a wide variety of all-in-one digital signage and kiosk applications. VIA Mobile360 HMI Panel Display Starter Kit The VIA Mobile360 HMI Panel Display Starter Kit feature a highly-integrated low power motherboard and validated LCD screens to provide the fastest and smoothest path for building smart display devices for a wide variety of all-in-one digital signage and kiosk applications. It includes the VIA VTS-8588 board and an optional 17” display that can be easily customized for a wide variety of retail, business, and infotainment applications. Its Linux BSP is optimized to enable modern, HTML5-based digital signage applications, and includes hardware-accelerated video decoding in the Chromium browser. For more information about VIA Mobile360 HMI Panel Starter Kit, please visit: http://www.viatech.com/en/solutions/digital-signage/mobile360-hmi-panel-display-starter-kit/ For images related to the VIA Mobile360 HMI Panel Display Starter Kit: https://www.viagallery.com/via-products/via-embedded-arm-solutions/mobile360-hmi-panel-display-starter-kit/ About VIA Technologies, Inc. VIA Technologies, Inc is a global leader in the development of highly-integrated embedded platform and system solutions for M2M, IoT, and Smart City applications, ranging fr|om video walls and digital signage to healthcare and industrial automation. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the many world’s leading hi-tech, telecommunications, consumer electronics industry brand names. www.viatech.com Posted in Press Releases, Press Releases 2016 Post navigation ← VIA Mobile360 Surround View System @ the 2016 Mid-America Trucking Show VIA Announces March Consolidated Sales Results →