UP Core Plus is the 2nd Generation of UP Core modular maker boards, powered by Intel Apollo Lake processors, with Net Plus and Vision Plus X boards which offer customization for your project. AAEON, an award winning developer of Edge AI Computing solutions, announces the 2nd Generation of UP modular boards, the UP Core Plus maker board along with the Net Plus and Vision Plus X docking boards. Together these board kits provide developers and easy way to build a system designed for the needs of their project, whether it’s a compact networking device, or a powerful AI Edge system. The UP Core Plus is the 2nd Generation of the UP modular maker board fr|om AAEON. Featuring Intel Apollo Lake processors, the UP Core Plus offers a great leap in performance over the previous generation. The board can be configured with up to 8 GB of onboard memory, and up to 128 GB onboard eMMC storage. The UP Core Plus also features USB 3.0, DP, and USB OTG connections, as well as support for wireless and Bluetooth connectivity. The UP Core Plus also supports up to four PCI express lanes thanks to the Apollo Lake processors. While the UP Core Plus has fewer I/O ports than the UP Squared, it offers unmatched flexibility thanks to its two 100-pin connectors. With these connectors, users can add-on docking boards that help tailor the board to their applications. AAEON currently offers two boards as part of the UP Core Plus family, the Net Plus and UP Vision Plus X. The Net Plus docking board expands the I/O support of the UP Core Plus system, with four Intel i211 Gigabit LAN ports, or optional Intel i210 with Time-Sensitive Network (TSN) support. It also features a SATA port for hard drive support, as well as an mPCIe slot which supports a wide range of Mini-Card solutions, including 4G, WiFi, and more. The Net Plus is perfect for developers looking to build a compact network device, or to connect multiple network devices to the system. The Vision Plus X board brings the power of AI@Edge to the UP Core Plus. Featuring three Intel Movidius Myriad X VPUs, the Vision Plus X offers a high-performance solution to powering AI applications. With a built in mPCIe slot, developers can push the count up to four Intel Myriad X VPUs with the addition of the AI Core X module. The Vision Plus X is perfect for bringing to life AI Edge applications such as facial recognition and smart retail. The UP Core Plus fr|om AAEON offers developers unmatched flexibility to power their projects. Users can use the UP Core Plus board as a standalone system by itself, or expand with the Net Plus or Vision Plus X boards. AAEON also offers a carrier board design guide available through the UP Community, allowing users to build their own custom board configurations and layouts. The 2nd Generation modular board, UP Core Plus fr|om AAEON, is built to power up your project.

AAEON announces the launch of the ASDM-S-KBU smart display module featuring 7th Generation Intel Core processors and OpenVINO capabilities for applications such as kiosks and displays with AI context-recognition applications. AAEON, an industry leader in embedded solutions, announces the ASDM-S-KBU, the only Intel SDM Small (SDM-S) module featuring 7th Generation Intel Core processors (formerly Kaby Lake). The ASDM-S-KBU offers unparalleled computing power for its compact size, capable of powering AI Edge applications. The ASDM-S-KBU brings the high performance of Intel Core processors to the compact Intel SDM-S form factor. As small as a credit card, the ASDM-S-KBU combines the 7th Generation Intel Core series and Celeron 3965U processors with up to 8GB of DDR memory, providing scalability for smart displays that are slimmer and more compact. The ASDM-S-KBU can power embedded computing applications such as interactive kiosks and smart vending machines. The ASDM-S-KBU features the performance to push smart displays to the Edge. Tested compatible with OpenVINO, the ASDM-S-KBU can power AI Edge applications for smart displays. Applications include context sensing in virtual dressing rooms, which can determine a person’s age, gender and body shape. It can also be used to power Smart Retail and Smart Vending solutions, or even deployed as part of the Smart City ecosystem. The ASDM-S-KBU is backed by the same industry leading support offered with all AAEON products. fr|om technical service that promises a response within 72 hours, to our manufacture services and OEM/ODM support, AAEON is the reliable partner for developers and system integrators. AAEON offers end-to-end support for the ASDM-S-KBU, including carrier boards and system chassis to help you build your project. “The ASDM-S-KBU brings the power of Intel Core processors and Edge Computing to compact smart display systems,” said Ian Lin, Project Manager with AAEON’s Embedded Computing Division. “Backed with AAEON support, the ASDM-S-KBU is the best solution for smart displays in education, digital signage, and more.”

The FWS-7831 network appliance fr|om AAEON is a network solution that brings capable and powerful network applications in a platform that is friendly to both users and budgets. AAEON, an industry leader in network solutions, announces the FWS-7831 network appliance. The FWS-7831 is powered by the 8th Generation Intel Core and Xeon processors, formerly Coffee Lake, and offers powerful network applications such as UTM and SD-WAN in a package that is both user and budget friendly. The FWS-7831 is designed with support for the 8th Generation Intel Core and Xeon processors (Coffee Lake) up to 6 cores. Combined with up to 32 GB of DDR4 SODIMM ECC memory, the FWS-7831 is powerful enough to provide over 48 Gbps throughput depending on configuration. With the FWS-7831, AAEON continues to offer network appliances built with flexibility. The FWS-7831 can be configured with eight Intel i211 Gigabit Ethernet ports, or two SFP Ethernet ports with six Intel i211 Ethernet ports. The FWS-7831 also features a NIM slot, perfect for additional expansion and customization, allowing customers up to eight additional ports, for a total of up to 16 Ethernet ports supported. Customers can also use the NIM module for network virtualization. Other I/O features include USB 3.0, RJ-45 console, and HDMI ports. The FWS-7831 is also built to be a friendly to use system. With a shorter chassis than most typical rackmount systems, the FWS-7831 is easy to set up and install even without a rack, and can be used outside of dedicated server rooms. It provides users with support for applications such as unified threat management (UTM) and software defined wide access networks (SD-WAN). It can also be paired with other network appliances for web monitoring and load balancing applications. “The FWS-7831 is a cost effective and user friendly network solution for customers looking for a mid-range network solution,” said Caridee Hung, Product Manager with AAEON’s Network Systems Division. “Customers will find exactly the solution they need thanks to the 8th Generation Intel Core and Xeon Processors and the flexibility provided by the FWS-7831.” The FWS-7831 is the newest addition to the family of network appliances fr|om AAEON, and joins the FWS-7830 in expanding our range of appliances powered by the 8th Generation Intel Core and Xeon Processors.

5G는 이미 본격적으로 기존의 4G 표준을 대체하고 있으며, 그 비전은 가히 혁명적이라고 할 수 있습니다. 4G만 해도 다운로드 속도가 빠르다고 여겨지고 있는데 5G는 그 속도를 10배로 늘릴 수 있습니다! 더 나아가, 지연 시간이 현격하게 짧기 때문에 디바이스들 간 연락 속도도 훨씬 더 빨라집니다. 5G를 mMTC (Massive Machine-Type Communications, 대규모 사물통신)와 결합하면 넓은 지역에 걸쳐 수천 대의 디바이스 간에 수월한 통신이 가능해지며, 그에 따라 대규모로 AIoT 솔루션을 구현하는 데 따른 통신 문제도 해결할 수 있습니다. 대표적인 예를 들면, 이를 이용해 차량 간 통신과 무인 차량 신뢰도가 높아져 교통 상황을 더 안전하고 효율적으로 만들 수 있을 것입니다. 5G 네트워크는 SDN (Software Defined Networks, 소프트웨어 정의 네트워크)과 NFV (Network Function Virtualization, 네트워크 기능 가상화)를 통해 실현 가능합니다. 이러한 유형의 인프라는 엄청난 규모의 사용량 증가가 예상되는 상황과 급격한 수요 등락에 맞춘 확장을 처리하는 데 필요합니다. 다시 말해, 여기서 중요한 것은 연결성이 아니라 실행하는 애플리케이션들을 모두 처리하는 중앙 인프라의 성능이라는 것입니다. 그것이 바로 충분한 메모리가 반드시 필요한 이유이며, 특히 5G 네트워크의 핵심 부분의 경우 더욱 그렇습니다. Innodisk는 서버와 네트워크용으로 최적화되고 빠른 전송 속도를 자랑하는 고용량 모듈을 공급하고 있습니다. 모든 IC는 오리지널 제품이며 엄격한 사내 테스트를 통과했습니다. 또한, 모든 DRAM 솔루션은 고정 BOM과 함께 제공되는 만큼 공급을 염려하실 필요가 없습니다. mMTC (대규모 사물통신)  •단일 네트워크를 통해 수천 대의 디바이스 간 연결 원활화 •테스트를 거친 오리지널 IC 와 고정 BOM으로 신뢰할 수 있는 DRAM으로 구동 최고의 신뢰도를 자랑하는 저지연 통신  •무인 차량, 공장 로봇 등 디바이스 간 신속한 통신 지원 •저지연 네트워크 속도 지원을 위해 고속 2666MHz DRAM 사용 기하급수적 대역폭 증가  •속도 증가는 네트워크 상에 연결된 디바이스와 애플리케이션 수의 증가를 의미 •고용량 32GB DRAM 모듈로 수요 충족

With a storage and memory portfolio highly suitable for IoT applications, Innodisk is ready to help solve the challenges of AI implementation in the medical market Taipei – Medical technology is one of the fields where AI can bring revolutionizing breakthroughs for diagnostics, patient care, and emergency rooms. AI excels at working through enormous data sets and can draw fr|om experiences much wider than any single doctor. But this sophisticated technology requires sufficient computational powers, and this is where the Innodisk solution excels. Innodisk’s memory solution includes a diverse portfolio of industrial-grade DRAM modules that comes with guaranteed long-term supply. Other than high-performance DDR4 modules, DDR2 and DDR3 solutions are also available in the same robust form factors. For extreme cases, conformal coating and anti-sulfuration measures are available to further protect the memory module. Innodisk has ample experience in providing storage solutions to the medical sector. For instance, when designing an MR or CR systems, it is necessary to factor in electromagnetic interference. A special circuit design with purpose-built firmware algorithms is necessary and Innodisk has successfully customized modules with anti-magnetic properties as well as with rigid data security measures for medical devices. Innodisk can provide SSDs that offer extensive endurance and the robustness required of IoT devices in a medical setting. One of the challenges of AIoT is keeping tabs on the many devices involved in the system. In one such case, Innodisk modified the cloud-based management tool iCAP to not only monitor the onboard component lifespan and status, but also that of the batteries in the various portable devices used at the hospital. This way, all devices are kept under one umbrella that is easily accessed through any computer, phone or tablet with a compatible browser. Another aspect of adding devices is the need for adding additional ways of communication between the devices themselves. This is easily achievable through Innodisk’s expansion cards. This way, medical devices can easily add new ports that offer additional LAN, display, PoE, USB capabilities.

Using Sophisticated Demos, Innodisk is Demonstrating How Memory and Storage can power Smart Surveillance, Smart Transportation, Smart Factory and Smart Medical Applications Taipei – AI is the future of IoT. To highlight the possibilities these bring, Innodisk is showcasing four of the main AIoT markets at Computex 2019. Facial Recognition and AI-powered Transportation  The first thing to greet visitors to the booth is a facial recognition entrance. This setup shows how entering and exiting the office can be done in a secure and unobtrusive manner. Moving on, we enter the transportation area where a real-time fleet management system is run through Innodisk’s cloud management platform iCAP™. Additionally, a miniature scale intersection will showcase how vehicles can be tracked through an intersection to help analyze and streamline traffic flow. Smarter Quality Control and Medical Innovation  The next section is the Smart Factory which shows how AI and machine vision can detect discrepancies in fabrics faster and more keenly than any human operator. And lastly, we arrive at the Innodisk Smart Medical segment where a customized iCAP platform demonstrates how a nursing station can integrate all connected devices under one umbrella for easy management. Latest Innovations  Fire is no issue for data retention with the new Fire Shield SSD. Successfully tested to withstand 800°C for 30 minutes, the Fire Shield SSD can save your data if disaster strikes. For the DRAM side, the 32GB modules are ready to bring high capacity to the IoT market. Combining this with wide temperature, Anti-Sulfuration and ECC functionalities gives you the optimal industrial-grade DRAM solution. For expansion cards, the new M.2 Graphics Card can deliver both 4K UHD and FHD. With a DDR3 IC on board, this miniature graphics card is tailor-made for space-constrained IoT applications.

Years of experimentation and innovative design has culminated in Innodisk’s newest “Black Box” data storage device for transportation and in-vehicle recording, the Fire Shield SSD™ Taipei –After many trials and a lengthy design process, the Fire Shield SSD™ has passed its baptism of fire. After having been bathed in direct flames at 800°C for more than 30 minutes, comparisons show 100% data accuracy before and after tests. The U.S. patent has already been granted USPTO. The Fire Shield SSD™ design borrows fr|om the concept of black boxes. It is placed inside vehicles and public transportation for the purpose of facilitating accident investigation. Modern vehicles are designed with safety in mind. But no matter the safety measures, fire is always a risk. In the US alone, there are more than 400 fire-related vehicle accidents every year, and what is often forgotten is the importance of data after such an accident, as it might be the only clue to the underlying causes. This is why Innodisk has created the Fire Shield SSD™. The Fire Shield SSD™ consists of a triple layer of protection between the environment and the core components. The layers include flame-resistant copper alloy, drive-protecting connector design, and heat-isolating lining material. By combining more than 20 different heat-resistant materials with low heat-conducting properties, the SSD effectively shields the NAND flash fr|om extreme heat. Innodisk’s Fire Shield SSD™ is available as a SATA 3.5” SSD form factor and will be displayed at Innodisk’s booth at this year’s Computex in Taipei.  

The BOXER-8150AI powered by NVidia Jetson TX2 features eight USB 3.0 ports providing higher bandwidth for USB cameras and devices. AAEON, an industry leader in AI solutions, announces the BOXER-8150AI, the latest in the BOXER-8100AI family of compact embedded AI Edge solutions powered by NVIDIA Jetson TX2. Featuring eight USB 3.0 ports, the BOXER-8150AI is designed to maximize framerates by providing higher bandwidth for USB connected cameras. The BOXER-8150AI features the powerful NVIDIA Jetson TX2 CPU paired with 8GB LPDDR4 memory and 32GB eMMC storage onboard. The NVIDIA Jetson TX2 utilizes a unique design to provide 6-cores of processing power by pairing the Dual Denver 2 and Quad ARM 57 processors into a single SOC. The NVIDIA Jetson TX2 is capable of supporting up to 256 CUDA cores and supports AI frameworks such as TensorFlow and Caffe, and can be configured to utilize the customer’s own AI inference software. The BOXER-8150AI stands out fr|om the crowd with its unique configuration of eight USB 3.0 ports. The BOXER-8150AI is designed with four USB chips, each controlling a pair of USB 3.0 ports. By dedicating one chip to one pair of ports, each chip handles less data traffic overall, improving bandwidth fr|om connected devices and allowing the BOXER-8150AI to maximize processing speeds and framerates. Higher framerates allow for AI software to process images faster, more reliably and with greater accuracy. With this configuration, the BOXER-8150AI is able to support up to eight USB connected cameras or devices, each operating independently of one another. This powerful configuration is perfect for a wide range of computer vision applications like visual inspection, quality control, and facial recognition. The I/O features of the BOXER-8150AI doesn’t just stop with its USB ports. The BOXER-8150AI features a COM port for easy integration into industrial systems. It also features a Gigabit Ethernet port and two antenna ports for easy connection to any kind of network, or even as a mobile device. Other I/O features include two HDMI 2.0 ports, an SD Card slot, USB OTG, and remote ON/OFF. Built for Industry 4.0, the BOXER-8150AI features a fanless design and all aluminum chassis, making it tough enough to handle he rigors of any work place. It is capable of operating in temperature ranges fr|om -20°C to 50°C and features a wide input voltage range of 10 to 24 VDC. With a compact size only 30 mm thick, it’s another design fr|om AAEON that is built to work anywhere you need it. “The BOXER-8150AI offers a unique design which maximizes bandwidth and provides higher framerates for developers and customers who require their application to interface with a large number of USB connected devices,” said Ethan Chiu, Product Manager with AAEON System Platform Division. “The BOXER-8150AI is the embedded system that offers AI at the speed of sight.”

  The AI Core XP4 and XP8 offer up to eight Intel Movidius Myriad X VPUs on a PCI Express [x4] card, and provide users with scalability for PC-based AI applications.AAEON, an award-winning leader of AI edge solutions, announces the latest products in our line of AI modules featuring the Intel Movidius Myriad X, the AI Core XP4 and XP8. The AI Core XP4 and XP8 offer users a scalable solution on a PCIe(x4) form factor for PC-based AI applications and neural network acceleration.While most PCs are capable of handling AI applications, the computations required are often quite complex and data intensive, limiting the speed at which the AI inference can operate, or slowing down performance of other applications which must run simultaneously. The AI Core XP4 and XP8 allow users to offload the AI inference fr|om the main CPU processor, speeding up AI processing, and freeing the CPU to handle other important tasks.The AI Core XP4 and XP8 feature four (XP4) or eight (XP8) Intel Movidius Myriad X VPUs. Each Intel Myriad X VPU is capable of speeds up to 105 fps (80 typical) and up to 1 trillion floating point operations as a dedicated neural network. This means a performance of up to 840 fps (560 typical) with the AI Core XP8, providing incredible processing power for your AI applications.The AI Core XP4 and XP8 bring users scalability not offered on any other PCIe based AI module card. While other cards are designed with VPUs soldered directly onto the boards, the AI Core XP4 and XP8 are designed by combining two to four AI Core XM 2280 modules onto a single card. This means the AI Core XP4 and XP8 feature four M.2 slots, allowing users the ability to scale the capabilities of the card to match their needs. Users can easily add an additional AI Core XM 2280 module to the AI Core XP4 giving the power of six Intel Myriad X VPUs. This scalability is perfect for users whose processing needs may change over time, or are unsure exactly how much performance they need; providing the option to change the power available without having to buy an entire new card.As with all of our award winning products, AAEON offers manufacturer service for customers who have exact needs, providing support in finding and developing solutions to fit your needs. The AI Core XP4 and XP8 bring more flexibility and scalability to our innovative line of AI Core X modules featuring Intel Myriad X, and provides a powerful solution for PC-based AI edge applications.

While e-commerce gets all the attention, research conducted by the IHL Group shows that big chains plan to open more than 5,500 more stores than they close in 2018. But even as traditional stores continue to thrive, retail is becoming ever more competitive. To deal with the ongoing transformation of the marketplace, many merchants are seeking to emulate e-commerce in how they use data to increase sales and improve customer service. Bringing these smarts out of the cloud and into the store requires a new approach to collecting, managing, and analyzing data. Specifically, retailers need deep learning solutions that provide value at the edge, handling large volumes of images and data within retail locations-¬. The solution often requires using heterogeneous mixes of CPUs, GPUs, FPGAs, and other processors, while adhering to strict power, space, bandwidth, and privacy requirements. With that in mind, developers are discovering ways to use existing APIs and frameworks to maximize the portability, flexibility, and scalability of their retail solutions. Developers are also relying on a new generation of off-the-shelf AI hardware and software specifically designed for edge applications. Suchtechnologies simplify and speed up the creation of new solutions, allowing developers to apply the power of AI and machine learning to new environments. XXXL Performance in Petite Sizes A retail AI solution must produce, store, and manage a vast amount of data—particularly for solutions based around video analytics. Cloud-based solutions are often infeasible due to latency, network bandwidth, reliability, and security issues. What’s needed for retail is an edge solution that offers tremendous compute power while requiring relatively little energy. On top of that, it must fit into a small form factor. Recent developments at Intel® support solutions that offer the necessary requirements. UP Bridge the Gap, a brand of AAEON Europe, has developed a family of neural accelerators that run on cutting-edge hardware. Powered by Intel® Movidius™ Myriad™ X VPUs, these cards are designed to handle computer vision and AI applications in a tiny, low-power package (Figure 1). Figure 1. The UP AI Core X series is powered by Intel® Movidius™ Myriad™ X VPUs. (Source: UP Bridge the Gap) For example, these cards are used in the UP Squared AI Edge: Retail Suite, a quick-to-deploy neural network engine designed for modern commerce. The Retail Suite comes preloaded with software fr|om AIM2 and Cortexica, and supports frameworks such as Caffe, TensorFlow, and the OpenVINO Toolkit. It comes with: A 30x51mm UP Squared board based on an Intel Atom® x7-E3950 4GB RAM An Intel Movidius Myriad X 2485 VPU 64GB eMMC, WiFi (2T2R), and Bluetooth A USB3.0 camera with 3.6mm lens A pre-installed 1-year subscription to Retail Suite by AIM2 Available as a developer kit, the Retail Suite with its Intel Movidius Myriad X VPU delivers an estimated 10X performance increase over previous generations, making it a powerful option for AI at the edge. (See Figure 2.) Figure 2. The Intel® Movidius™ Myriad™ X VPU delivers an estimated 10X performance increase over previous generations. (Source: UP Bridge the Gap ) AI and Machine Learning Empower Retail The goal is an intelligent solution to extract insights fr|om video analysis to perform demographic, behavioral, and sentiment analysis. Retailers want to easily call up data on the age or gender distribution of customers, be it by the month or day of the week, as well as their emotional state. Do they appear happy or confused? Are they focused on specific brands or are they ignoring them? All of this can help retailers enhance their stores. We spoke about this solution with Luca Ruzzola, a machine learning engineer who leads data science and training at AIM2. He explained that the Retail Suite can be launched in Contextual Mode or in Brand Mode. In Contextual Mode, retailers gain contextual information for customer analysis. “The solution associates key performance indicators (KPIs) to a specific context,” said Ruzzola. “For example, a context can be the brand on a shelf, the name of a venue in a shopping center, or a specific zone of a venue such as the entrance or exit.” In Brand Mode, retailers can automate inventory tracking at the shelf level. Ruzzola said, “The solution enables retailers to improve efficiency. This includes stock detection and shelf monitoring to make sure that brands are positioned correctly and in the correct amount.” Brand exposure is also measurable. “It tracks customers standing in front of branded products on a shelf and how they engage with the products,” said Ruzzola. “It also enables retailers to track and analyze the types of customers that interact with the products—their gender, age range—while ensuring compliance with the General Data Protection Regulation (GDPR).” The mention of GDPR led to a discussion on the solution’s privacy settings. Ruzzola made clear that no video stream is transmitted and no frames are saved on the device. “The video processing occurs in real time,” said Ruzzola, “by creating a face signature using Neural Homogeneous Identities (NHI).” NHI enables the solution to automatically detect and organize identities without human support. Each face signature is encrypted and stored in a database. “However, the process of creating a face signature can’t be used to re-create an image of a specific face,” said Ruzzola. This face signature allows retailers to recognize when a specific customer re-enters the store without capturing his or her personal identity. That way the retailer can track an individual’s shopping habits, age range and gender, while ensuring privacy and security. Ruzzola described other face signature use cases, such as ensuring that only authorized employees can access restricted storage areas or offices. A related use case is to confirm that specific employees, such as security staff, are present in specific areas at specific times and performing specific functions. Not All AI Acts the Same Our conversation moved on to other companies developing in this space. Ruzzola explained that the Retail Suite differs fr|om its competitors by providing three critical advantages. First, the solution’s dual-mode system enables retailers to capture and analyze both contextual data and brand interaction data. “No other solution handles both of these aspects in a single suite,” he said. A second advantage is low cost. “AAEON hardware and the Intel stack keep costs down,” said Ruzzola. The third advantage is that the solution can deliver standard KPIs or raw data. “Standard KPIs allow retailers to quickly gain insight without analysts,” said Ruzzola, “or they can engage an analyst to scrutinize the raw data to achieve additional insight.” Closing the Gap with E-Commerce As AI and machine learning technologies mature and their costs come down, brick-and-mortar retailers can perform the kind of customer, brand, and product analytics that e-tailers take for granted. Retailers, excited about such opportunities, are gaining insight into customer behavior and preferences as well as which brands outperform others. The result? Retailers are more competitive and customer-driven.

Choosing the most appropriate server boot drive can save time, safeguard your data, and — ultimately — lower your total cost of ownershipEvery server needs to boot fr|om a local drive. These drives come in a variety of form factors and with a diversity of interfaces and protocols. Each type of drive embodies different advantages (and disadvantages), so deciding which is best isn’t necessarily a clear-cut choice.The first thing that might come to mind is performance requirements. Time shaved off the boot sequence can be immensely valuable. As for challenges, power consumption and heat dispersal are constant threats to server performance. Minimizing the amount of power consumed is certainly in the best interest of any data center operator, not to mention the fact that high temperatures can exacerbate data retention issues in flash memory.So what are the choices to consider, and who are the upcoming players? Let’s dive into the current status of server boot drives and see what the future holds.

Available in six SKUs, there's a BOXER-6841M model for all your AI and machine vision requirementsAAEON, a leading developer of advanced industrial solutions and AI hardware, launches the BOXER-6841M, a box PC built for both edge AI and machine vision applications. The controller is available in six different SKUs, with four AI models featuring PCIe(x16) slots for the installation of Nvidia® GPUs, and two machine vision models fitted with a pair of PCIe(x8) slots for frame grabber cards.Different BOXER-6841M models are built to support either Intel® Core® i desktop or Xeon® server grade CPUs, and they all boast up to 32GB of DDR4 ECC or non-ECC SODIMM memory and two 2.5” drive bays.The four AI models can be fitted with up to 250W GPUs. To support the high power requirements of these GPUs, AAEON has designed the BOXER-6841M with two 12Vdc power inputs. This innovative feature lowers costs and makes the system more stable by reducing the level of wasted heat that would be produced by a single 24V input.ALL BOXER-6841M SKUs feature five GbE LAN ports, four USB3.0 ports, two HDMI ports, dual mSATA slots, and an additional PCIe(x1) slot. The machine vision models can also support up to five COM ports to support legacy devices.“The BOXER-6841M is a range of computers rather than a single machine, and that means we can answer our customers’ image processing requirements, whatever they might be,” said Ethan Chiu, AAEON system platform division product manager.

The BOXER-6750 features an Intel® Core™ i3-6100U CPUAAEON, a leading developer of industrial computing solutions, releases the BOXER-6750, a DIN rail-mount-designed box PC with a rich I/O interface.The compact BOXER-6750 measures only 69mm x 183mm x 155mm and is fitted with the Intel® Core™ i3-6100U or, for customers with lower performance demands, the Intel® Celeron® 3955U. The system also features a DDR4 SODIMM slot for up to 16GB of memory, a 2.5” SATA drive bay, and an optional mSATA slot.The high-performance PC is perfect for SCADA applications, and with four USB3.0 ports, two LAN ports, and four COM ports, it can easily be connected to a range of peripheral devices. VGA and HDMI ports also enable dual display output. AAEON can also work with customers to customize the system, giving it up to six USB3.0 ports and six COM ports.The BOXER-6750 is also suitable for factory automation solutions and was designed to handle harsh, factory environments. It has an operating temperature range of -20°C to 60°C and a 9 to 30V power input range.“Ease of use is always an important factor when we design new systems,” said Roy Huang, AAEON System Platform Division product manager. “With the BOXER-6750, the majority of the system’s connectors are located on the PC’s front panel, making it ideally suited to DIN rail installation.”

Italian Post Office Shortens Queue Waiting Times with VIA Mobile360 HMI Panel Display Starter Kit Posted on March 31, 2016April 4, 2016 by Helena Szendzielorz Enhances the customer experience by providing critical real-time information Taipei, Taiwan, 31 March, 2016 – VIA Technologies, Inc, today announced that the Italian Post Office has deployed intelligent signage systems based on the VIA Mobile360 HMI Panel Display Starter Kit in post offices throughout the country. The customized all-in-one systems have been installed at each counter as part of a queue management system that allows customers to pre-book an appointment using the Italian Post Office mobile app. When the customer arrives for their appointment, they can view the display at the counter that was pre-assigned to them by the app to track their place in the line. In addition, large summary displays powered by VIA AMOS-820 systems have also been installed to greet customers as they enter the post offices, as well as provide back-up in the case of server downtime. “As more and more companies look for ways to integrate the convenience of mobile services with physical spaces, digital signage and kiosk installations are fast becoming an integral feature for all retail environments,” said Richard Brown, VP International Marketing, VIA Technologies, Inc. “With our new VIA Mobile360 HMI Starter Kits, we provide a flexible and affordable path for custom-building solutions that meet the exact requirements of the target deployment.” VIA Mobile360 HMI Starter Kits feature a highly-integrated low power motherboard and validated LCD screens to provide the fastest and smoothest path for building smart display devices for a wide variety of all-in-one digital signage and kiosk applications. VIA Mobile360 HMI Panel Display Starter Kit The VIA Mobile360 HMI Panel Display Starter Kit feature a highly-integrated low power motherboard and validated LCD screens to provide the fastest and smoothest path for building smart display devices for a wide variety of all-in-one digital signage and kiosk applications. It includes the VIA VTS-8588 board and an optional 17” display that can be easily customized for a wide variety of retail, business, and infotainment applications. Its Linux BSP is optimized to enable modern, HTML5-based digital signage applications, and includes hardware-accelerated video decoding in the Chromium browser. For more information about VIA Mobile360 HMI Panel Starter Kit, please visit: http://www.viatech.com/en/solutions/digital-signage/mobile360-hmi-panel-display-starter-kit/ For images related to the VIA Mobile360 HMI Panel Display Starter Kit: https://www.viagallery.com/via-products/via-embedded-arm-solutions/mobile360-hmi-panel-display-starter-kit/ About VIA Technologies, Inc. VIA Technologies, Inc is a global leader in the development of highly-integrated embedded platform and system solutions for M2M, IoT, and Smart City applications, ranging fr|om video walls and digital signage to healthcare and industrial automation. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the many world’s leading hi-tech, telecommunications, consumer electronics industry brand names. www.viatech.com Posted in Press Releases, Press Releases 2016 Post navigation ← VIA Mobile360 Surround View System @ the 2016 Mid-America Trucking Show VIA Announces March Consolidated Sales Results →

Mobile360 In-Vehicle Surround View Fleet Management System The VIA Mobile360 In-Vehicle Surround View Fleet Management System is a turnkey solution that accelerates the time-to-market for 360° real-time video monitoring and recording systems for commercial transportation applications. Key features include: 360° real-time display VIA Multi-Stitch technology Local recording and storage Up to 8 PoE or 8 CSI camera support Ruggedized design with extended temperature Flexible voltage input The system delivers real-time in-vehicle rec The system enhances vehicle safety by increasing driver visibility when turning corners, parking in tight spaces, or reversing, and virtually eliminating the blind spots that are commonly found using conventional 2D video monitoring technologies. With its NVR capabilities, the system can also be used to capture and store footage of accidents and security breaches that may also occur to the vehicle. Combining a ruggedized design featuring advanced video processing capabilities and support for multiple camera inputs with a flexible video software development platform, the system can be customized to meet the requirements for multiple in-vehicle real-time 360° video monitoring and recording applications and environments. VIA Multi-Stitch Technology VIA Multi-Stitch technology supports advanced graphics and video processing features, including Source Calibration, Culling, De-fisheye, Perspective Transform, Orientation, Repositioning, and Side View Geometric calibration, in order to ensure the highest-quality real-time 360° video streams. VIA Mobile360 Surround View System With its ruggedized chassis, extended temperature support, and flexible voltage input, the VIA Mobile 360 Surround View system has been specifically designed to withstand the rigors of the road. Combining support for up to eight PoE or eight CSI cameras with advanced video processing capabilities, including video encoding for remote viewing, the system has all the performance and scalability required for recording and delivering stunning real-time 360° spherical images fr|om even the most demanding environments.   System Hardware I/O Connectivity 2 USB 3.0 Ports 4 USB 2.0 Ports 1 CANBus 1 Gigabit Ethernet Port 1 Lockable HDMI Port (4K) 1 DisplayPort Port Wireless Connectivity Wi-Fi Support (With Access Point -AP) 4G & GPS Support Bluetooth Support Camera Options Support for up to 8 CSI Cameras Support for up to 8 PoE Power Options 10 ~ 30V DC-in Intelligent Power Ignition Power Backup (2+ hours) Storage Option 2 Hot Swappable 2.5" HDDs RAID Support Extended Connectivity USB-GPIO (Panic Button) For high resolution images of the VIA Mobile360 Surround View Fleet Management System please visit our VIA Gallery.  

VIA Mobile360 Surround View System @ the 2016 Mid-America Trucking Show Posted on March 29, 2016May 18, 2016 by Helena Szendzielorz Delivers real-time 360° monitoring and recording capabilities on the road Taipei, Taiwan, 29 March, 2016 – VIA Technologies, Inc, today announced that it will demonstrate the new cutting-edge in-vehicle VIA Mobile360 Surround View System during the 2016 Mid-America Trucking Show being held fr|om March 31st to April 2nd in Booth 60113  of the Kentucky Expo Center, in Louisville Kentucky. Specifically designed f “The VIA Mobile360 Surround View System is one of the latest additions to our Smart Transportation Solutions Portfolio,” said Richard Brown, VP International Marketing, VIA Technologies, Inc. “By creating a 360° view of a vehicle, the system dramatically increases safety by eliminating driver blind spots while turning corners, changing lanes, reversing, or parking in tight spaces.” In addition to the VIA Mobile360 Surround View System, VIA will also be showcasing other popular Smart Transportation solutions such as the VIA AMOS-825 and VIA AMOS-3005 ultra-compact systems within our booth during the show. For more information about the VIA Mobile360 Surround View System, please visit: http://www.viatech.com/en/solutions/transportation/mobile360-surround-fleet-management/ For images related to this release, please visit: mobile360-in-vehicle-surround-view-fleet-management-system

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Innodisk Launches New Generation M.2 LAN Card The EGPL series with PCIe interface expands dual Gigabit Ethernet for increased flexibility.   May 10, 2016 – Taipei, Taiwan - Innodisk, the service-driven provider of flash, memory and peripheral module for industrial and embedded systems, launches a new generation M.2 LAN card. M.2 (known as the NGFF - Next Generation Form Factor) is a new generation of specifications for embedded extensions designed to support PCIe and USB 3.0 interface. High-speed bandwidth comes as a standard specification of mini-STX and NUC. It may be used on type 2280, 2260 and other various modules. Innodisk announced the world’s first M.2 LAN card EGUL series at the end of last year and was awarded Electronic Design’s “Product of the Week.” We launched its extension line EGPL series to support PCIe, type 2280 and additional operating platforms such as Linux, FreeBSD, Android and VxWorks.      Dual Gigabit LAN for Various Applications                                                                     The demand for bandwidth and connectivity capabilities is increasing significantly as the Internet of Things (IoT) and the demand for networking devices across the world grows. The M.2 LAN card provides dual Gigabit Ethernet to expand bandwidth and supports the following three functions: link aggregation, which combines two Ethernet links to improve speed; failover, which switches to a redundant network when the failure of one network occurs providing a backup mode; and load balancing, which optimizes resource use and avoiding the overload of any single resource and ensuring quality of work.   M.2 LAN Card Product Information Innodisk’s M.2 LAN card complies with both 2000V surge protection and 2000V HiPOT protection, offering high voltage isolation protection in order to prevent electrical damage to the system. Additionally, it features ESD (±8/15KV) to ensure the system’s dependability within unstable environments.  There are two series of M.2 LAN cards with 1 Available now is the Innodisk M.2 LAN card EGPL/EGUL series. For additional information, please contact your local Innodisk sales representatives or distributors, or visit us at www.innodisk.com.  

Innodisk Announces DDR4 Mini DIMM Series DRAM Aimed at Communications Applications May 5, 2016 – Taipei, Taiwan - Innodisk, the service-driven flash and DRAM module provider, introduces a brand new DDR4 Mini DIMM DRAM that is fully compliant with ATCA (Advanced Telecom Computing Architecture). Featuring a 228 pin (a mere 0.72” in height) and a capacity of up to 16GB, it is simply the best choice for small, high-speed, large-capacity storage devices.   Top-grade specifications for higher performance Innodisk uses original ICs in DDR4 Mini DIMM and has upgraded the transfer speed up to 2400MHz. Its ECC modules are designed to detect and correct single-bit errors that may occur during data storage and transmission. In addition, the DDR4 Mini DIMM series’ built-in thermal sensor provides temperature monitoring and system reliability. Innodisk also utilizes value-added conformal coating on the module that protects against moisture, contaminants, dust and acid materials, thus ensuring high-performance operation in harsh environments.   Ultra-low profile height to improve airflow and thermal performance Using Mini DIMM can save up to 1/3 more of the system’s space compared to using SODIMM. Innodisk’s DDR4 Mini DIMM’s specifications include a length of 8.2 cm and an ultra-low profile height 1.8 cm, making it suitable for the most space-constrained 1U blade servers, networking devices, routers and telecommunications. Available now is the Innodisk DDR4 Mini DIMM module series. For additional information on this product and our DDR4 series, please contact your local Innodisk sales representatives or distributors or visit us at www.innodisk.com.